prikaz prve stranice dokumenta Numerical modelling of heat transfer and dissipation in power electronics applications
Embargo period 2028-07-21
master's thesis
Numerical modelling of heat transfer and dissipation in power electronics applications
Zagreb: University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, 2023. urn:nbn:hr:235:760227
Vodopija, Igor
University of Zagreb
Faculty of Mechanical Engineering and Naval Architecture

Institutional repository: Repository of Faculty of Mechanical Engineering and Naval Architecture University of Zagreb

Cite this document

Vodopija, I. (2023). Numerical modelling of heat transfer and dissipation in power electronics applications (Master's thesis). Zagreb: University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture. Retrieved from https://urn.nsk.hr/urn:nbn:hr:235:760227

Vodopija, Igor. "Numerical modelling of heat transfer and dissipation in power electronics applications." Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, 2023. https://urn.nsk.hr/urn:nbn:hr:235:760227

Vodopija, Igor. "Numerical modelling of heat transfer and dissipation in power electronics applications." Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, 2023. https://urn.nsk.hr/urn:nbn:hr:235:760227

Vodopija, I. (2023). 'Numerical modelling of heat transfer and dissipation in power electronics applications', Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, accessed 07 August 2024, https://urn.nsk.hr/urn:nbn:hr:235:760227

Vodopija I. Numerical modelling of heat transfer and dissipation in power electronics applications [Master's thesis]. Zagreb: University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture; 2023 [cited 2024 August 07] Available at: https://urn.nsk.hr/urn:nbn:hr:235:760227

I. Vodopija, "Numerical modelling of heat transfer and dissipation in power electronics applications", Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, Zagreb, 2023. Available at: https://urn.nsk.hr/urn:nbn:hr:235:760227

Metadata
TitleNumerical modelling of heat transfer and dissipation in power electronics applications
Title (english)Numerical modelling of heat transfer and dissipation in power electronics applications
AuthorIgor Vodopija
MentorMilan Vujanović (mentor)
GranterUniversity of Zagreb
Faculty of Mechanical Engineering and Naval Architecture
Zagreb
Defense date and country2023-07-21, Croatia
Scientific / art field,
discipline and subdiscipline		TECHNICAL SCIENCES
Mechanical Engineering
Process Energy Engineering
Abstract
Ovaj se diplomski rad bavi analizom prijenosa i disipacije topline unutar sklopa elektroničkih energetskih modula koji su montirani na hladnjak, koristeći numeričke simulacije u softverskom paketu AVL FIRE M. Diplomski rad je napravljen u suradnji s tvrtkom AVL. U radu je validiran numerički model putem već napravljenih eksperimentalnih mjerenja temperature čipova. Mjerenja su napravljena u Grazu, u laboratoriju tvrtke AVL. Nakon toga napravljen je niz parametarskih analiza s ciljem analize utjecaja radnih parametara na hlađenje čipova te, posljedično, temperature sklopa. Rezultati usporedbe eksperimentalnih mjerenja i numeričkih simulacija pokazuju najveću grešku odstupanja maksimalnih temperatura u iznosu od 5.2 °C. Parametarskim analizama je pokazano da je za povećanje prijenosa topline i smanjenje pada tlaka najučinkovitije promjeniti volumni udio etilen glikola u smjesi etilen glikol-voda, koja služi kao rashladni medij u hladnjaku. Rezultati dobiveni ovim parametarskim analizama služit će za dizajniranje učinkovitijih sustava hlađenja sklopova energetske elektronike.
Abstract (english)
This Master’s Thesis focuses on analyzing heat transfer and dissipation in electronic power module assemblies mounted on coolers. The analysis is conducted using numerical simulations with the AVL FIRE M software package. This Thesis was conducted in collaboration with AVL, a leading company in the field. The Thesis problem starts with validating the numerical model by comparing it with experimental chip temperature measurements. The measurements were conducted at AVL’s laboratory in Graz. Subsequently, a series of parametric analyses were performed to investigate the impact of operating parameters on chip cooling and temperatures of the assembly’s components. The comparison between experimental measurements and numerical simulations revealed a maximum deviation error of 5.2 °C. The parametric analyses highlighted that the most effective approach to enhance heat transfer and reduce pressure drop is by adjusting the volume fraction of ethylene glycol in the ethylene glycol-water mixture used as the cooling medium, passing through the heatsink. These findings will contribute to the development of more efficient cooling systems for power electronics assemblies.
Keywords
Keywords (english)
Languagecroatian
URN:NBNurn:nbn:hr:235:760227
Study programmeTitle: Mechanical Engineering
Study programme type: university
Study level: graduate
Academic / professional title: magistar/magistra inženjer/inženjerka strojarstva (magistar/magistra inženjer/inženjerka strojarstva)
Type of resourceText
File originBorn digital
Access conditionsEmbargoed access
Embargo expiration date: 2028-07-21
Terms of useLicence In copyright icon
Created on2023-07-05 11:13:38