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master's thesis
Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading
Zagreb: University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, 2012. urn:nbn:hr:235:431960
Ključar, Luka
University of Zagreb
Faculty of Mechanical Engineering and Naval Architecture

Institutional repository: Repository of Faculty of Mechanical Engineering and Naval Architecture University of Zagreb

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Ključar, L. (2012). Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading (Master's thesis). Zagreb: University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture. Retrieved from https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar, Luka. "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading." Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, 2012. https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar, Luka. "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading." Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, 2012. https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar, L. (2012). 'Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading', Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, accessed 03 December 2024, https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar L. Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading [Master's thesis]. Zagreb: University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture; 2012 [cited 2024 December 03] Available at: https://urn.nsk.hr/urn:nbn:hr:235:431960

L. Ključar, "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading", Master's thesis, University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, Zagreb, 2012. Available at: https://urn.nsk.hr/urn:nbn:hr:235:431960

Metadata
TitleFatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading
Title (croatian)Dinamička čvrstoća lemljenih spojeva elektroničkih sklopova uslijed cikličkog toplinskog i vibracijskog opterećenja
AuthorLuka Ključar
MentorŽeljko Božić (mentor)
GranterUniversity of Zagreb
Faculty of Mechanical Engineering and Naval Architecture
Zagreb
Defense date and country2012-01-27, Croatia
Scientific / art field,
discipline and subdiscipline		TECHNICAL SCIENCES
Mechanical Engineering
Abstract
In this thesis an analysis of a simple PCB (Printed Circuit Board) under combined thermal and vibration loading has been conducted in order to estimate the fatigue life of the solder joints. This includes a FEM (Finite Element Method) dynamic and thermal analysis of solder joints. The goal was to develop a feasible FEM based methodology for combined thermal and vibration loading. In order to increase the understanding the problem of the fatigue of solder joints, a number of theoretical fundamentals are given, which include an introduction to vibration fundamentals, which include basics of vibration of plates, time independent inelastic material behavior is described and an overview of LCF (Low Cycle Fatigue) and HCF (High Cycle Fatigue) is also given.
Abstract (croatian)
U ovom radu je izvršena analiza jednostavnog PCB-a (Printed Circuit Board) pod toplinskim i vibracijskim opterećenjem kako bi se odredio životni vijek lemljenih spojeva. Analiza uključuje toplinsku i dinamičku analizu metodom konačnih elemenata (MKE). Kako bi se bolje razumio problem zamora lemljenih spojeva, dan je uvod u teorijske osnove vibracija, što uključuje vibracije ploča, uvod u vremenski neovsino neelastično ponašanje materijala, te je dan pregled LCF-a (Low Cycle Fatigue) i HCF-a (High Cycle Fatigue).
Keywords
Languageenglish
URN:NBNurn:nbn:hr:235:431960
Study programmeTitle: Mechanical Engineering
Study programme type: university
Study level: graduate
Academic / professional title: magistar/magistra inženjer/inženjerka strojarstva (magistar/magistra inženjer/inženjerka strojarstva)
Type of resourceText
File originBorn digital
Access conditionsOpen access
Terms of useLicence In copyright icon
Created on2019-05-22 00:10:55