Ključar, L. (2012). Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading (Diplomski rad). Zagreb: Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje. Preuzeto s https://urn.nsk.hr/urn:nbn:hr:235:431960
Ključar, Luka. "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading." Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, 2012. https://urn.nsk.hr/urn:nbn:hr:235:431960
Ključar, Luka. "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading." Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, 2012. https://urn.nsk.hr/urn:nbn:hr:235:431960
Ključar, L. (2012). 'Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading', Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, citirano: 09.09.2024., https://urn.nsk.hr/urn:nbn:hr:235:431960
Ključar L. Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading [Diplomski rad]. Zagreb: Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje; 2012 [pristupljeno 09.09.2024.] Dostupno na: https://urn.nsk.hr/urn:nbn:hr:235:431960
L. Ključar, "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading", Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, Zagreb, 2012. Dostupno na: https://urn.nsk.hr/urn:nbn:hr:235:431960